San Francisco, USA – April 1, 2025 (OFC 2025) – At the OFC 2025 exhibition, US Conec and T&S officially signed a global patent licensing agreement for MDC connectors and adapters. Under this agreement, T&S has been granted a non-exclusive license to 11 core patents from US Conec, authorizing the manufacturing and global sales of MDC high-density fiber optic connectors and adapters based on US Conec’s patented technology. These components are essential for the deployment of 800G and 1.6T Ethernet networks.
With AI computing clusters surpassing 100,000 GPU nodes, the demand for higher-density and higher-performance optical connectivity continues to grow, posing challenges for traditional fiber optic connectors. With its innovative design, MDC technology offers a critical solution for high-density, duplex optical interconnects while ensuring signal integrity. This collaboration will accelerate industry standardization, facilitate large-scale deployment of 800G OSFP/QSFP-DD optical modules, and provide high-reliability board-to-board connectivity for Co-Packaged Optics (CPO). Additionally, T&S will offer MDC duplex and MMC multi-fiber cabling and transceivers, further strengthening T&S’s foundation in high density interconnect solutions.
T&S Communication is a globally renowned manufacturer of optical communication components. Headquartered in Shenzhen, China, T&S delivers a comprehensive portfolio of high-performance optical connectivity products and effective services to the global telecom and data communications markets. Its product portfolio includes ceramic ferrules, MT ferrules, a full range of high-density connectivity components, active components, and fiber optic sensing solutions. For more information, visit www.china-tscom.com.
US Conec is a globally recognized innovator in high-density optical interconnect solutions. With over three decades of expertise, the company delivers cutting-edge components for data centers, enterprise structured cabling, public networks, circuit board interconnections, and industrial and military applications worldwide. US Conec is backed by three communications technology leaders—Corning Optical Communications, Fujikura, and NTT-AT. For more details, visit www.usconec.com
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