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200G QSFP56 TO 2QSFP56 DAC

200G QSFP56 TO 2QSFP56 DAC

QSFP56 passive copper cable assembly feature eight differential copper pairs, providing four data transmission channels at speeds up to 56Gbps(PAM4) per channel, and meets 200G Ethernet and InfiniBand requirements. Available in a broad rang of wire gages-from 26AWG through 30AWG-this 200G copper cable assembly features low insertion loss and low cross talk.

QSFP56 uses PAM4 signals for transmission, which doubles the rate. However, there are more stringent requirements for cable insertion loss. For detailed requirements, please see High Speed Characteristics.

Designed for applications in the data center, networking and telecommunications markets that require a high speed, reliable cable assembly, this next generation product shares the same mating interface with QSFP+ form factor, making it backward compatible with existing QSFP ports.

Features and Benefits of 200G QSFP56 Breakout DAC

  • Compatible with IEEE 802.3bj and IEEE 802.3cd

  • Supports aggregate data rates of 200Gbps(PAM4)

  • Optimized construction to minimize insertion loss and cross talk

  • Pull-to-release slide latch design

  • 28AWG through 30AWG cable

  • Straight and break out assembly configurations available

  • Customized cable braid termination limits EMI radiation

  • Customizable EEPROM mapping for cable signature

  • RoHS Compatible



Applications of 200G QSFP56 Breakout DAC

  • Switches, servers and routers

  • Data Center networks

  • Storage area networks

  • High performance computing

  • Telecommunication and wireless infrastructure

  • Medical diagnostics and networking

  • Test and measurement equipment

  • 200G Ethernet (IEEE 802.3cd)

  • InfiniBand

Specifications of 200G QSFP56 TO 2x100G DAC

Recommended Operation Condition
Pin Descriptions
High Speed Characteristics

Parameter

Symbol

Min

Max

Unit

Operating Case Temperature

Topc

0

70

degC

Storage Temperature

Tst

-40

85

degC

Relative Humidity (non-condensation)

RS

35

60

%

Supply Voltage

VCC3

3.135

3.465

V

Voltage on LVTTL Input

Vilvttl

-0.3

VCC3  +0.2

V

Power Supply Current

ICC3

-

15

mA

Total Power Consumption

Pd

-

0.05

W

Notes:

Stress or conditions exceed the above range may cause permanent damage to the device.

This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not applied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.


Pin

Logic

Symbol

Description

1

-

GND

Ground

2

CML-I

Tx2n

Transmitter Inverted Data Input

3

CML-I

Tx2p

Transmitter Non-Inverted Data Input

4

-

GND

Ground

5

CML-I

Tx4n

Transmitter Inverted Data Input

6

CML-I

Tx4p

Transmitter Non-Inverted Data Input

7

-

GND

Ground

8

LVTTL-I

ModSelL

Module Select

9

LVTTL-I

ResetL

Module Reset

10

-

Vcc Rx

+3.3V Power Supply Receiver

11

LVCMOS-

SCL

2-wire serial interface clock


I/O



12

LVCMOS-

SDA

2-wire serial interface data


I/O



13

-

GND

Ground

14

CML-O

Rx3p

Receiver Non-Inverted Data Output

15

CML-O

Rx3n

Receiver Inverted Data Output

16

-

GND

Ground

17

CML-O

Rx1p

Receiver Non-Inverted Data Output

18

CML-O

Rx1n

Receiver Inverted Data Output

19

-

GND

Ground

20

-

GND

Ground

21

CML-O

Rx2n

Receiver Inverted Data Output

22

CML-O

Rx2p

Receiver Non-Inverted Data Output

23

-

GND

Ground

24

CML-O

Rx4n

Receiver Inverted Data Output

25

CML-O

Rx4p

Receiver Non-Inverted Data Output

26

-

GND

Ground

27

LVTTL-O

ModPrsL

Module Present

28

LVTTL-O

IntL

Interrupt

29

-

Vcc Tx

+3.3V Power supply transmitter

30

-

Vcc1

+3.3V Power supply

31

LVTTL-I

LPMode

Low Power Mode

32

-

GND

Ground

33

CML-I

Tx3p

Transmitter Non-Inverted Data Input

34

CML-I

Tx3n

Transmitter Inverted Data Input

35

-

GND

Ground

36

CML-I

Tx1p

Transmitter Non-Inverted Data Input

37

CML-I

Tx1n

Transmitter Inverted Data Input

38

-

GND

Ground


Parameter

Symbol

Min

Typical

Max

Unit

Note

Differential Impedance

TDR

90

100

110

Ώ

-

Insertion loss

SDD21

-16.06

-

-

dB

At 13.28 GHz

Differential Return Loss

SDD11

SDD22

-

-

See 1

dB

At 0.05 to 4.1 GHz

-

-

See 2

dB

At 4.1 to 19 GHz

Common-mode to common-mode output return loss

SCC11

SCC22

-

-

-2

dB

At 0.2 to 19 GHz

Differential to common-mode

return loss

SCD11

SCD22

-

-

See 3

dB

At 0.01 to 12.89 GHz

-

-

See 4

At 12.89 to 19 GHz

Differential to common Mode

Conversion Loss

SCD21-IL

-

-

-10

dB

At 0.01 to 12.89 GHz

-

-

See 5

At 12.89 to 15.7 GHz

-

-

-6.3

At 15.7 to 19 GHz

Notes:

1. Reflection Coefficient given by equation SDD11(dB) < -16.5 + 2 × SQRT(f ), with f in GHz

2. Reflection Coefficient given by equation SDD11(dB) < -10.66 + 14 ×logo10/5.5, with f in GHz

3. Reflection Coefficient given by equation SCD11(dB) < -22 + (20/25.78)*f, with f in GHz

4. Reflection Coefficient given by equation SCD11(dB) < -15 + (6/25.78)*f, with f in GHz

Reflection Coefficient given by equation SCD21(dB) < -27 + (29/22)*f, with f in GHz


Pin Descriptions of 200G QSFP56 Breakout DAC

Pin Descriptions of 200G QSFP56 Breakout DAC



Mechanical Specifications of of 200G QSFP56 Breakout DAC

The connector is compatible with the SFF-8436 specification.


Mechanical Specifications of of 200G QSFP56 Breakout DAC


Length (m)

Cable AWG

1

30

2

26/30

3

26



Regulatory Compliance of 200G QSFP56 Breakout DAC

Feature

Test Method

Performance

Electrostatic Discharge (ESD) to the Electrical Pins

MIL-STD-883C Method 3015.7

Class 1(>2000 Volts)

Electromagnetic Interference(EMI)

FCC Class B

Compliant with Standards

CENELEC EN55022 Class B

CISPR22 ITE Class B

RF Immunity(RFI)

IEC61000-4-3

Typically Show no Measurable Effect from a 10V/m Field Swept from 80 to 1000MHz

RoHS Compliance

RoHS Directive 2011/65/EU and it's Amendment Directives 6/6

RoHS 6/6 compliant


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